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发明名称
MOLD CYLINDER FOR SEMICONDUCTOR PACKAGE MOLDING
摘要
申请公布号
KR960004351(Y1)
申请公布日期
1996.05.25
申请号
KR19930005414U
申请日期
1993.04.07
申请人
PARK, MAN - YONG
发明人
PARK, MAN - YONG
分类号
H01L21/56;(IPC1-7):H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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