发明名称 CIRCUIT FORMING METHOD BY LASER, AND PART HAVING CONDUCTIVE CIRCUIT FORMED THEREBY
摘要 PURPOSE: To provide a method for manufacturing efficiently and comparably simply a molded part having accurate conductive circuits on its surface, especially, having independent circuits of each other, without the damaging its appearance, shape and insulating quality, etc. CONSTITUTION: On the surface of a molded part made of synthetic resin, an initial metallic film 1-10μm thick is formed by a preliminary metallic-coating processing. Then, on this metallic film, a resist film 1-20μm thick is formed by an electrodeposition or electrostatic coating. Thereafter, while the resist is removed by projecting a laser beam on a conductive circuit section the metallic film of the conductive circuit section is exposed to the outside, and a second metallic film having a desired thickness is formed on the conductive circuit section by an electrical plating. Thereafter, the residual resists are removed from the sections other than the conductive circuit section, and the conductive circuits are formed while metallic films left in the sections to be insulation circuits are removed therefrom by etching liquid.
申请公布号 JPH08167769(A) 申请公布日期 1996.06.25
申请号 JP19940307539 申请日期 1994.12.12
申请人 POLYPLASTICS CO 发明人 MIYASHITA TAKAYUKI
分类号 B23K26/00;H01L21/027;H05K3/18 主分类号 B23K26/00
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