Extended landing pad substrate package structure and method

摘要

An extended landing pad substrate package includes a dielectric layer having an upper surface and an opposite lower surface. A lower circuit pattern is embedded in the lower surface of the dielectric layer. The lower circuit pattern includes traces having a first thickness and extended landing pads having a second thickness greater than the first thickness. Blind via apertures are formed through an upper circuit pattern embedded into the upper surface of the dielectric layer, through the dielectric layer and to the extended landing pads. The length of the blind via apertures is minimized due to the increase second thickness of the extended landing pads as compared to the first thickness of traces. Accordingly, the width of the blind via apertures at the upper surface of the dielectric layer is minimized.

主权项

1. A method of forming an extended landing pad substrate package, the method comprising:
plating a primary conductor layer, the primary conductor layer comprising:
a trace having a first thickness; andan extended landing pad foundation portion having the first thickness; selectively plating an extension conductor layer on the extended landing pad foundation portion but not on the trace, the extension conductor layer comprising:
an extended landing pad extension portion on the extended landing pad foundation portion, the extended landing pad extension portion and the extended landing pad foundation portion forming an extended landing pad having a second thickness greater than the first thickness; laminating a first circuit pattern comprising the trace and the extended landing pad into a dielectric layer; and forming a blind via aperture extending through the dielectric layer and to the extended landing pad.