Enhanced ball grid array

摘要

A two-dimensional array of bonding pads is formed on a first major surface of a substrate. At least some of the pads are connected to conductors that extend across or into the substrate. The pads can be classified in two groups. A first group is conventional, each pad providing a continuous electrically conductive surface on which a solder ball or solder bump may be formed. In the second group, each pad has a plurality of isolated electrically conductive regions that are connected to different conductors that extend across or into the substrate. Solder balls or solder bumps having a first height are mounted on some of the pads. Multi-terminal devices that have a height that is no more than that of the first height are mounted on at least some of the second group of pads; and their terminals are connected to different electrically conductive regions.

主权项

1. A device package comprising:
a substrate having first and second major surfaces and electrical conductors extending across or into the substrate; a two-dimensional array of pads formed on the first major surface of the substrate, first and second subsets of the pads being connected to the electrical conductors, each pad of the second subset of the pads having a plurality of isolated electrically conductive regions that are connected to different conductors; solder balls or solder bumps formed on the first subset of the pads, said solder balls or solder bumps having a first height; and other devices formed on the second subset of the pads that have a height that is no more than that of the first height, wherein each of the other devices is directly mounted on one of the second subset of the pads, wherein each of the other devices comprises multiple terminals, and wherein each of the multiple terminals of one of the other devices is electrically connected to a different one of the plurality of isolated electrically conductive regions of one of the second subset of the pads.