| 发明名称 | Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same | ||
| 摘要 | The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component, conductive elements, a package body, a shield, a magnetic insulating layer, and a patterned conductive layer. The carrier has a top surface on which the electronic component is disposed. The conductive elements are disposed on the top surface of the carrier. The package body is disposed on the top surface of the carrier and encapsulates the electronic component and a portion of each of the conductive elements. The shield is disposed on the package body and covers an exterior of the package body. The magnetic insulating layer is disposed on a top surface of the shield. The patterned conductive layer is disposed on the magnetic insulating layer. Each of the conductive elements electrically connects the patterned conductive layer to the electronic component. | ||
| 申请公布号 | US9461001(B1) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201514805847 | 申请日期 | 2015.07.22 |
| 申请人 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 发明人 | Tsai Ming-Horng;Chen Wei-Yu;Lee Chun-Chia;Li Huan Wun |
| 分类号 | H01L23/552;H01L23/31;H01L23/538;H01L21/52;H01L21/26;H01L21/768;H01L23/04;H01L23/64;H01L21/48;H01L21/56;H02J7/02 | 主分类号 | H01L23/552 |
| 代理机构 | Foley & Lardner LLP | 代理人 | Foley & Lardner LLP ;Liu Cliff Z.;Murch Angela D. |
| 主权项 | 1. A semiconductor device package, comprising a carrier having a top surface; an electronic component disposed on the top surface of the carrier; at least two conductive elements disposed on the top surface of the carrier; a package body disposed on the top surface of the carrier and encapsulating the electronic component and a portion of each of the conductive elements; a shield disposed on the package body and covering an exterior of the package body; a magnetic insulating layer disposed on a top surface of the shield; and a patterned conductive layer disposed on the magnetic insulating layer, wherein each of the conductive elements electrically connects the patterned conductive layer to the electronic component; and wherein the shield comprises multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers, and wherein at least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer. | ||
| 地址 | Kaosiung TW | ||