| 摘要 |
This protective-film-forming film (12) is for forming a protective film that protects a metal film provided on the back side of a semiconductor chip, and whereof peeling from the metal film is suppressed even if a temperature variation history has been gone through. The protective-film-forming film is formed from a protective-film-forming composition comprising mixed therein a coupling agent having a thiol group or a protected thiol group. |
