发明名称 |
CHEMICAL-MECHANICAL POLISHING OF THIN MATERIALS USING A PULSE POLISHING TECHNIQUE |
摘要 |
<p>Uniform chemical-mechanical planarization is achieved at a high material removal rate by pulsing the pressure applied to the wafer undergoing planarization between an initial optimum pressure and a reduced second pressure, preferably about 0 psi.</p> |
申请公布号 |
WO9624466(A1) |
申请公布日期 |
1996.08.15 |
申请号 |
WO1996US00151 |
申请日期 |
1996.01.11 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SALUGSUGAN, ISIDORE |
分类号 |
B24B37/04;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|