SEMICONDUCTOR DEVICE

摘要

PURPOSE: To greatly increase bonding strength between resin of a package of a semiconductor device and a lead even if the semiconductor device is for mounting a large pellet by bonding an inner lead to a circuit formation surface of a pellet to be mounted. CONSTITUTION: An insulation sheet 5 sized not to cover a bonding pad is bonded to a circuit formation surface of a pellet 1. An inner lead of a lead 2a with an outer lead in a side of a bonding pad non-formation side of a pellet is extended to an upper surface of the insulation sheet 5. A tip of an inside of each lead 2a is positioned before a bonding pad and is bonded to the insulation sheet 5a. That is, an inner lead of the lead 2a is extended to a circuit formation surface between a plurality of bonding pads arranged in a circuit formation surface along one side la of the pellet 1 and the other side 1b opposite to the one side 1a.