| 摘要 |
<p>PURPOSE: To reduce effectively the volume of a gas entrained into a space between a resin film and a metal band by specifying a surface pressure, lamination velocity and the temperature of a metal band when laminating the resin film to the metal band. CONSTITUTION: A surface pressure generated between a resin film 2, 2' and a metal band 1 is reduced so that the surface pressure stands at 20kgf/cm<2> or higher and 1000kgf/cm<2> or lower, and the relationship between the surface pressure (kgf/cm<2> ) and lamination velocity (m/min) is set to satisfy the following formula. In addition, the temperature of the metal band is set below the melting point of the resin film 2, 2' on the metal band side immediately after the pressure attachment of the metal band. Further, the temperature of the metal band is set below the glass transition temperature of the resin film 2, 2' in the cooling part 11. Preferably, the atmosphere of a part where a pressure attachment begins is saturated using a gas with a molecular weight of 44 or less. The surface pressure-10>= (lamination velocity)<2> /1000. Thus it is possible to prevent an environment from becoming polluted by a solvent in a coating/baking step, and also reduce the consumption of a solvent volatility energy to a zero.</p> |
