发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern. |
申请公布号 |
US2016300778(A1) |
申请公布日期 |
2016.10.13 |
申请号 |
US201615180627 |
申请日期 |
2016.06.13 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
NISHIJIMA Takahiro;KATSUKI Takashi;DENTA Toshio |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor device comprising:
an insulating substrate including a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate of the insulating substrate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing, wherein the circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern. |
地址 |
Kawasaki-shi JP |