发明名称 ENCAPSULATION SYSTEM AND ENCAPSULATION METHOD
摘要 The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system comprising a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant. With the technical solution of the present disclosure, the encapsulant can be heated properly based on its actual state such that the encapsulant at the to-be-heated location can all sufficiently melt, which effectively improves the sealing of the product.
申请公布号 US2016300769(A1) 申请公布日期 2016.10.13
申请号 US201514777596 申请日期 2015.03.17
申请人 BOE TECHNOLOGY GROUP CO., LTD. ;BEIJING BOE OPTOELCTRONICS TECHNOLOGY CO., LTD. 发明人 YANG Jiuxia;BAI Feng;ZHANG Liang;CHEN Xu;XIAO Ang
分类号 H01L21/66;H01L51/52;H01L51/56 主分类号 H01L21/66
代理机构 代理人
主权项
地址 Beijing CN