CIRCUIT CHIP BEARING DEVICE AND ITS MANUFACTURE

摘要

PURPOSE: To provide an improved method of manufacturing high density card device having intricate functions. CONSTITUTION: A plurality of circuit chips 14 are fixed onto a flexible carrying member 16, which is prepared by providing a plurality of electrically conductive leads on a flexible tape. Electrical wiring pattern 40 is formed on the surface 34 of a substrate carrying member 30. By binding the flexible carrying member and the substrate carrying member with each other, at least two circuit chips in a plurality of the circuit chips are electrically connected through the wiring pattern.