| 摘要 |
<p>PURPOSE: To obtain a multilayer wiring board having a capacitor part of stabilized characteristics, and a package for semiconductor element, by preventing the components of a highly dielectric layer from being diffused into an electrode layer or an insulator layer. CONSTITUTION: In the multilayer wiring board having a capacitor part 6 comprising a high dielectric layer 3 sandwiched by a pair of electrode layers 4, 5, and a package for semiconductor element, the high dielectric layer 3 is composed of a glass phase containing Al2 O3 particles, 5-95vol.% of zirconate particles, at least one kind of oxide of alkaline earth metal, rare earth element, Al and Si present at the grain boundary thereof and an oxide of Zr. An insulator layer is composed of a glass phase containing alumina particles, zirconate particles, at least one kind of oxide of alkaline earth metal, rare earth element, Al and Si and an oxide of Zr.</p> |
