| 摘要 |
<p>PURPOSE: To provide a lightweight and low price electronic apparatus in which the heat generated from a heating body mounted on a circuit board can be dissipated effectively. CONSTITUTION: A part of a housing 11 is constituted of a cover 41 made of a material having high thermal conductivity. The cover partially touches a heating body 3 mounted on a board 2 and partially exposed to the outer air. A part of the housing 11 is composed of a material having high thermal conductivity and that part is brought into contact with the heating body in the housing so that the cover serves as a heat sink. When the cover is arranged to be exposed partially to the outside, the heat dissipation effect is accelerated through natural convection and the metal part is reduced without sacrifice of the heat dissipation effect for the heating body in the housing thus realizing cost reduction and weigh reduction of electronic apparatus. Furthermore, the cover is provided with fins 42 in order to enhance the heat dissipation effect.</p> |
