SURFACE ACOUSTIC WAVE DEVICE AND ITS MANUFACTURE

摘要

PURPOSE: To realize the surface acoustic wave device with small size, low height and excellent reliability. CONSTITUTION: An interdigital electrode section 102 and an electrode pad 103 are formed on a substrate 119 to form a surface acoustic wave element 101. A conductive bump 104 is formed on the electrode pad 103. An electrode pattern 108 is formed in the inside of the package 107 and an external electrode 109 integral with an electrode pattern 108 is formed to the outside of the package 107. The surface acoustic wave element 101 is mounted with face-down to the electrode pattern 108 via a conductive adhesives 105 coated to the conductive bump 104. An insulating adhesives 106 is filled around the conducive bump 104 and the conductive adhesives 105. A cover member 111 is fitted above the package 107 via a sealing part 110. A protection base 112 is fitted on the substrate 119 by using the direct bonding technology.