| 摘要 |
<p>PURPOSE: To provide a mold sealing type IC which has general purpose properties and can obtain very high heat dissipating effect by using a simple method, and a manufacturing method of it. CONSTITUTION: Unevenness parts constituted of lattice-shaped trenches 7 are formed on the surface of mold resin 6 of an IC 1, and a metal film layer like an aluminum film 8 is arranged on the surface of the unevenness parts. The metal film layer can be arranged by using any one out of a metal evaporation method, a sputtering method and an electroless plating method, and various kinds of shapes can be used as the unevenness parts.</p> |
