| 摘要 |
<p>PURPOSE: To provide a multilayer board protected against intrusion of an activation liquid or the like, being using in electroplating, by previously depositing a migration retardant metal on the surface of the multilayer board through electroless plating when a conductor pattern is formed on the surface of a multilayer board. CONSTITUTION: Many pores are left in a board 1 or on the surface after the binder removing, firing or polishing step of board forming process. Such board 1 is immersed into an electroless plating bath of migration retardant metal, e.g. Cu, and electroless plating is carried out. Consequently, a Cu plating film 8 is deposited on the surface of the board 1 and the pores 7 on the surface are filled with Cu. In the following activation process, the activation liquid is blocked by the Cu plating film 8 and prevented from intruding into the board 1.</p> |
