发明名称 A HEADPHONE ASSEMBLY
摘要 An audio listening device having a damped ball joint type interface between an ear-cup assembly and a headband assembly is provided. For example, the audio listening device can include a headband assembly comprising at least one end; an ear-cup assembly pivotably engaged to the at least one end of the headband assembly by an engagement structure, the engagement structure comprising at least two cooperatively coupled curved surfaces; and a damper rim coupled to the ear-cup assembly and to the at least one end of the headband assembly, wherein the damper rim is configured to at least partially constrict movement of the ear-cup assembly relative to the headband assembly.
申请公布号 HK1188666(A1) 申请公布日期 2016.10.21
申请号 HK20140101699 申请日期 2014.02.21
申请人 APPLE INC. 发明人 BRUNNER,ROBERT R;VANDENBUSSCHE,GREGOIRE G;FRUHAUF,CHRIS C
分类号 H04R 主分类号 H04R
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