| 摘要 |
<p>A curable polymethylsilsesquioxane composition necessary for producing products of curing of polymethylsilsesquioxane which have a flexibility enough for use as unsupported film, are free from practically problematic crack independent of the thickness of the filmy product, and are excellent in physical properties such as tensile strength. This composition comprises a curable polymethylsilsesquioxane having a molecular weight (M) of 380 to 2000 in terms of polystyrene and being represented by the general formula: [CH3SiO3/2]n[CH3Si(OH)O2/2]m {wherein m and n are positive numbers giving the above molecular weight and satisfying the relationship: 0.034/(M x 10-3) « m/(m + n) « 0.152/(M x 10-3) + 0.10}, and a curing catalyst and/or a curing agent. The composition exhibits excellent physical and chemical characteristics after curing and therefore are useful as surface-protective coating or heat-resistant coating for various materials.</p> |
