Arrangement for cooling subassemblies of an automation or control system

摘要

An arrangement for cooling subassemblies of an automation or control system is disclosed, wherein the subassemblies each comprise at least one printed circuit board (LP) having electronic components of different temperature sensitivity arranged thereon. The printed circuit board (LP) has at least one first portion for temperature-sensitive components and at least one second portion for temperature-insensitive components that generate waste heat. Interspaces are arranged between the first portion and the second portion, the interspaces each forming a thermally insulated trench. Means can be provided which keep away the heat over the temperature-sensitive components in a suitable manner and dissipate the waste heat from the printed circuit board (LP) before the heat reaches the temperature-sensitive components.

主权项

1. An arrangement for cooling subassemblies of an automation or control system, the subassemblies each having at least one printed circuit board (LP) with electronic components of different temperature sensitivity arranged thereon, the arrangement comprising:
at least one printed circuit board (LP) having at least one first sub-area for temperature-sensitive components and at least one second sub-area for temperature-insensitive components that give off waste heat, the at least one first sub-area for temperature-sensitive components and the at least one second sub-area for temperature-insensitive component arranged on a first side of the at least one printed circuit board; a thermally insulating trench arranged between the first sub-area and the second sub-area; at least one first heat sink having a cooling surface arranged directly over the temperature-sensitive components, and which is spaced apart from the at least one printed circuit board on the first side carrying the temperature-sensitive components by at least two thermally conductive elements; and at least one second heat sink having a cooling surface on the first side of the printed circuit board and arranged directly over the temperature-insensitive components that generate waste heat, and wherein the cooling surface of the at least one first heat sink is configured differently than the cooling surface of the at least one second heat sink.