| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame and a semiconductor device, wherein a lead located at a gap between adjacent semiconductor chips is hardly deformed, kept high in mechanical stability, and capable of preventing electromagnetic interference between adjacent semiconductor chips. SOLUTION: A lead frame is composed of chip mounts 11 and 12 where semiconductor chips 61 and 62 are mounted, a peripheral frame 2 which surrounds the chip mounts 11 and 12, support leads 31 to 34 which link the peripheral frame 2 with the mounts 11 and 12 to support the mounts 11 and 12, and leads 41 to 44 which extend from the peripheral frame 2 towards the chip mounts 11 and 12. A through lead 5 whose ends are linked to the peripheral frame 2 penetrating through the gap between the adjacent chip mounts 11 and 12 is provided between the adjacent chip mounts 11 and 12.</p> |
