| 摘要 |
PROBLEM TO BE SOLVED: To meet the major requirements for putting a product to practical use, which are low cost, high density and high reliability, allow almost no warpage of a substrate, provide excellent following performance of a polyimicle resin layer at a bent part, even when bending process which applies strong stress to bend nearly 90 degrees is performed, and prevent insulation failure. SOLUTION: On one side or both sides of a long-size stainless foil 1, a polyimide resin layer 2, which has a specific structure unit in the molecule, is formed on the whole or partial area so as to manufacture a board for making a circuit. As a board for making a circuit, the board can be compounded by forming a conductor layer 3 on the polyimide resin layer, and a circuit board is obtained by making a fine pattern by etching the conductor layer 3. The circuit board is preferably used for the suspension for a hard disc, and when photosensitive polyimide resin is used for the polyimide resin, the board is permitted to excel in fine processability. |
