DOUBLE ATTACHED MEMORY PACKAGE

摘要

A semiconductor package for a semiconductor memory device is described that can provide a double attached package. The first and second semiconductor chips are respectively equipped at the opposite sides of a rectangular die pad, and each have two unit chips formed in one body. The unit chips have electrode pads formed to face eachl other. Leads are formed around the four edges of the die pad, leaving a constant interval. Wires connect Leads to the electrode pads of the first and second semiconductor chips, where the electrode pads of the first semiconductor chip cross those of the second semiconductor chip. A body surrounds the first and second semiconductor chips and the wires. Thereby, it is possible to improve the equipment density and the reliability and simplify a packaging process.