| 摘要 |
A lead frame tie bar structure having quad-type integrated circuit package is disclosed. In the lead frame tie bar structure having quad-type integrated circuit package, a tie bar(g) is formed on an opposite portion of a mold gate(a) and a metal(h) is extended to an end portion of the tie bar(g), so that the extended part is extended to a edge portion of the package. Thereby, since an air of a bottom mold(M2) is transferred to the portion of tie bar(g) and the extended metal part(h) to be easily emitted to airvent(e), resulting in improving significantly a reliability without a void within the package.
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