| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the necessity of a metal mold and hence the necessity of a large plant and equipment investment even in the case of small-scale produc tion of a large variety, by providing a board which has a recess on a lateral side thereof and an insulating film which seals the aperture of the recess on a main surface of the board, and using a conductive portion formed in the recess as an external connection terminal for an IC chip. SOLUTION: A printed board 1a on which ICs such as a semiconductor memory, an optical sensor and an LED are loaded has a cut through hole (recess portion) 2a on a lateral side thereof. An insulating film 3 sealing the aperture of the recess portion 2a on a main surface of the board, an IC chip 4 loaded on a film arrangement surface of the board 1a, and a resin 6 sealing the IC chip 4 are provided. A conductive portion formed in the recess portion 2a is used as an external connection terminal for the IC chip 4. Thus, since a plurality of recess portions 2a on the board 1a may be used as external connection terminals for an optical sensor IC chip, it is not necessary to produce a metal mold for resin sealing. Therefore, a large plant and equipment investment is not required even in the case of small-scale production of a large variety.</p> |
