LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE

摘要

Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first pad and a second pad; a lead frame having a first electrode installed at one side of an electrode separation space and a second electrode installed at the other side thereof, and having the light emitting device seated thereon; a first bonding medium installed between the first pad and the first electrode so that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other; and a second bonding medium installed between the second pad and the second electrode so that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other, wherein at least one first accommodating cup part accommodating the first bonding medium therein is formed in the first electrode of the lead frame, and at least one second accommodating cup part accommodating the second bonding medium therein is formed in the second electrode of the lead frame.

主权项

1. A light emitting device package comprising:
a light emitting device including a first pad and a second pad; a lead frame including a first electrode disposed at one side of an electrode separation space and a second electrode disposed at the other side of the electrode separation space, and the lead frame having the light emitting device seated thereon; a first bonding medium disposed between the first pad and the first electrode so that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other; and a second bonding medium disposed between the second pad and the second electrode so that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other, wherein at least one first accommodating cup part configured to accommodate the first bonding medium therein is formed in the first electrode of the lead frame, and at least one second accommodating cup part configured to accommodate the second bonding medium therein is formed in the second electrode of the lead frame.