PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME

摘要

The present inventive concept provides a package substrate. The package substrate comprises an insulating substrate having a top surface a circuit pattern disposed on the top surface, and a multilayer conductive joint unit disposed on the circuit pattern. The multilayer conductive joint unit comprises a nickel layer which is in contact with the circuit pattern, and an aluminum layer disposed on the nickel layer and connected to a semiconductor chip mounted on the insulating substrate.

主权项

1. A package substrate comprising:
an insulating substrate having a top surface and a bottom surface; a circuit pattern is disposed on at least one of the top surface and the bottom surface of the insulating substrate; and a multilayer conductive joint unit disposed on the circuit pattern, wherein the multilayer conductive joint unit comprises:
a nickel layer in contact with the circuit pattern; andan aluminum layer on the nickel layer and electrically connected to a semiconductor chip mounted on the insulating substrate.