发明名称 FLEX RIGID MULTILAYER WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To utilize the space of a effectively by bending an exposed of a flexible wiring board having a connection terminal and then pasting the flexible wiring board to a rigid wiring board thereby integrating them. SOLUTION: An interlayer bonding sheet 4 and a rigid wiring board 6 are superposed on a flexible wiring board 1 laminated with a coverlay film 3 and then they are integrated by hot press. Subsequently, unnecessary part is removed from the rigid wiring board to expose a flexible wiring board partially to produce a flexible rigid multilayer wiring board. In such a multilayer wiring board, a conductor pattern of connection terminal 8 is provided on the flexible wiring board and the exposed part having the conductor pattern of connection terminal is folded onto the rigid wiring board through an adhesive sheet 4' and integrated by hot press thus producing a flexible rigid multilayer wiring board where a connection terminal 8 is arranged on the rigid wiring board part.</p>
申请公布号 JPH09191182(A) 申请公布日期 1997.07.22
申请号 JP19960018132 申请日期 1996.01.08
申请人 TOSHIBA CHEM CORP 发明人 YAMADA KOICHI;RI CHIYOUHOU
分类号 H05K1/11;H05K1/00;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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