| 摘要 |
<p>PURPOSE:To provide a substrate for mounting a semiconductor element and a manufacture of the substrate having a thin thickness, a high quality and a low manufacturing cost. CONSTITUTION:In a substrate for mounting a semiconductor element, the semiconductor element is mounted on the center of a base material 13, and a plurality of inner leads 23 connected to pads of the semiconductor element through metal wires, a conductor layer for power source and a conductor layer for installation are formed in a layered shape on the circumference of the base material 13. A metal plate is used as the base material 13. Further, lower insulating conductor layers comprising insulating adhesive layers 15, 19 and 21 joined on the lower layer, metal powder layers respectively fixed on the surface of the adhesive layers 15, 19 and 21, and plating layers 17, 19 and 22 formed on the surface of the metal powder layers are formed on the base material 13 in a plurality of steps so that each plating layer 17, 19 and 22 is sequentially exposed from the lower steps in the device mounting part. Moreover, in the plating layer 22 of the most upper part, the inner leads 23 are formed by a photoetching.</p> |
