| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the continuous operation test strength and temperature cycle strength of a semiconductor device when the semiconductor device is tested and evaluated while a manufacturing process is not changed and a heat radiation property is maintained by a method wherein trenches to which the center part and corner parts of a semiconductor chip are stuck are provided in the surface of a lead frame to which mounting material is applied. SOLUTION: A semiconductor chip 1 is fixed to a lead frame 2 in which trenches 5 are formed with melted mounting material 3. In order to fill the trench 5 with the mounting material 3 satisfactorily, the cross section of the trench 5 is semi-circular. Further, taking a thermal stress and the heat radiation into account, the width of the trench is about 1-2mm, the length is longer than the length of the semiconductor chip 1 mounted on the lead frame 2 and the depth is about 10-80μm. As the thickness of the mounting material 3 is partially increased by the trenches 5 provided in the lead frame 2, the thermal stress applied to the semiconductor device in the evaluation and the test can be absorbed by a plurality of parts. With this constitution, the continuous operation test strength and temperature cycle strength of the semiconductor device can be improved while a manufacturing process is not changed and a heat radiation property is maintained.</p> |
