| 摘要 |
<p>PROBLEM TO BE SOLVED: To stabilize accurately soldering in a chip resistor for a printed board and prevent rising of a chip by a method wherein a the external electrode is higher than a protection layer and a pentahedron in which its thickness is substantially equal to a width is formed. SOLUTION: Electrode paste is printed and sintered to form a side face electrode 18 of a pentahedron so that a part of a surface electrode B is coated on both side faces of a chip piece, and a nickel plating layer 19 and a solder plating layer 10 are formed on the surface electrode B and the side face electrode 18 to obtain a chip resistor 1. This is, the side face electrode is formed thickly with a 4-layer structure of the surface electrode layer, the side face electrode layer, the nickel plating layer and the solder plating layer, so that an external electrode is formed higher than a protection layer, rising of a chip is prevented without constraints of supply position of a chip resistor, it is possible to mount stably to a printed board and soldering can be stabilized.</p> |
