| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which a plated metal piece is not precipitated on a film body and in which the removal operation of the plated metal piece is not required by a method in which an electronic- component housing hole is covered with the film body so as to expose a through hole, a plating catalyst is given to the through hole and the plating catalyst which is stuck to the film body is removed. SOLUTION: An electronic-component housing hole 2 is covered with dry films on both faces of a multilayer board 15 so as to expose a through hole 3. Then, a film by a plating catalyst 6 is formed in the through hole 3. Then, the plating catalyst 6 which is stuck to surfaces of film bodies 8 is removed, and three surfaces of the film bodies 8 are exposed. Then, a metal film 9 is formed in the through hole 3 by using a copper sulfate plating liquid. Then, the remaining film bodies 8 are stripped by a sodium hydroxide aqueous solution, and the electronic-component housing hole 2 is exposed. Then, nickel films and gold films are precipitated on conductor circuits 4 exposed inside the electronic-component housing hole 2 and on the metal film 9 formed in the through hole 3.</p> |
