| 摘要 |
PURPOSE: To utilize resin efficiently and equalize pressures in the flow paths of a mold by a method wherein the resin is suuplied from one cavity to the other through resin flow paths which are provided in the parts of a lead frame. CONSTITUTION: Chips 13 are mounted on a lead frame 11 at the positions corresponding to the insides of a first cavity 5, a second cavity 7 and a third cavity 9 and the chips 13 are connected to the lead frame 11 with gold wires 14. An upper mold 12 and a lower mold 1 are closed. Plungers 17 are attached to the rod 15 of a molder with a rigid connection plate 16. Resin is cast into pots 2. By making the rod 15 of the molder descend, the plungers 17 which are linked with the rod 15 with the rigid connection plate 16 are also made to descend in the pots 2. The plungers 17 transfer the resin through pot linking flow paths 10 and runners 3 to fill the gates and cavities provided on the tips of the runners 3 with the resin. With this constitution, both the productivity and the product quality of a resin-molded semiconductor device can be improved significantly. |
