发明名称 ELECTRONIC COMPONENT BASE
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component base which enables providing a capacitor onto the upper surface of insulating layers having two or more circuit patterns laterally arrayed at predetermined intervals, or along the lateral direction between the insulating layers, without occupying a large area. SOLUTION: A via-hole 8 filled with a conductor 23 is provided in an insulating layer portion directly below each of circuit patterns 14 which are laterally arrayed at predetermined intervals. Also, a via-hole 8 filled with a ferroelectric material 22 is provided in an insulating layer portion which is located between the via-holes 8 filled with the conductors 23 and between the adjacent circuit patterns 14. Using these ferroelectric material 24 and conductor 23, a capacitor 24 is three-dimensionally provided in the direction of thickness of the insulating layer of the electronic component base.</p>
申请公布号 JPH09219466(A) 申请公布日期 1997.08.19
申请号 JP19960346645 申请日期 1996.12.09
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MIYAGAWA FUMIO;TAKENOUCHI TOSHIICHI;SAKAI HIROYUKI
分类号 H01L23/12;H01G2/06;H01G4/00;H05K1/16;H05K3/46;(IPC1-7):H01L23/12 主分类号 H01L23/12
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