| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed-wiring board and its manufacturing method without narrowing the effective area of the land for surface packaging part provided on the topmost surface side making said land hardly releasable. SOLUTION: This printed-wiring board is provided with a plurarity of wiring layers through the intermediary of an insulating layer 3 on an electric insulating substrate 1, a topmost wiring layer 22 covered with a surface protecting layer 6 and the surface exposed land 4 for surface packaged part formed by electrolytic plating step. In such a constitution, an electric insulating land holding layer 5 is provided along the outer peripheral edge of the land 4 for surface packaging part and closely adhering thereto for setting up the surface of this land holding layer 5 so as to compose almost the same surface as that of the land for surface packaging part or protruding upward. Furthermore, even if any external force is given to said land 4 in the releasing direction thereof, the release can be avoided by the action of the land holding layer 5.</p> |
