MANUFACTURE OF CHIP-TYPE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To prevent deformation in baking an insulating board and improve break performance. SOLUTION: A green sheet having a greater content of frit, which is a glass composition, than alumina is baked at low temperatures to form a large insulating board 1. Then, a surface electrode 20 and a film-like resistor 3, for example, as constituent element patterns of electronic components are formed on the same insulating board 1. Subsequently, break grooves B for sectioning unit regions 4 are provided, and the constituent element patterns are divided from the insulating board 1 along the break grooves B, thus obtaining stand-alone chip-type electronic components.