PROTECTIVE PLASTIC PACKAGE FOR PRINTED CIRCUIT BOARDS

摘要

Protective molded resilient flexible plastic package for a printed circuit board with a base and a cover member. The base and cover members have border regions with locking elements to detachably hold base and cover together to close the package. The border regions of one member has a wall which defines a step surface for contacting a marginal region of a surface of the board and a projection spaced from the step surface to engage the other surface of the board when this is in contact with the step surface. The other member has a rigid board engaging element for engaging the other surface of the board when the package is closed.