| 摘要 |
<p>The present invention provides for an integrated circuit chip (100) having one or more circuit elements (102) that perform a desired circuit function with the circuit elements being encompassed by a molding compound (108) that forms a package for the chip. The molding compound has a capacitance associated with it and the integrated circuit chip (100) includes a second integrated circuit element (104) within the molding compound (108) and which second integrated circuit element monitors the molding compound (108) to detect a change in capacitance in the molding compound (108) resulting from a removal of a portion or all of the molding compound (108). In response to a detection of a change in the capacitance, the second integrated circuit element (102) alters the desired circuit function provided by the other integrated circuit elements.</p> |
