| 摘要 |
<p>PURPOSE:To facilitate manufacture of a lead frame and to significantly shorten a manufacturing time by integrally composing an apparatus for shape-processing a lead frame body, an apparatus for shape-processing a ground plate, and an apparatus for shape-processing a power plate. CONSTITUTION:An apparatus for manufacturing a lead frame forms a multilayer lead frame formed by laminating a first conductive plate 2 as a ground plate and a second conductive plate 4 as a ground plate on a lead frame body 15, and comprises a main line 10 formed of a sequentially feeding die for punching a stripelike material partly plated on a predetermined region to form the body, then taping by using a tape supply line 40, laminating and assembling. The apparatus also comprises a first auxiliary line 20 for placing a semiconductor chip and forming the plate 2, and a second auxiliary line 30 for forming the plate 4. The line 10 is so integrally formed with the liens 20, 30 as to be perpendicular to the line 10.</p> |
