| 摘要 |
<p>PROBLEM TO BE SOLVED: To lower the overall height dimension for a module used for a contact type IC card without increasing the rate of generation and increasing the cost. SOLUTION: Terminal electrodes 14 for connecting respective inputs and outputs are formed on the surface of a film 11, and various kinds of wiring patterns 15 communicated with respective terminal electrodes for connecting respective inputs and outputs are so formed as to protrude inner leads 16 connected with one ends of patterns into release holes 13 of the film with their respective inner leads bonded with integrated circuit chips 12.</p> |
