发明名称 |
Champered electronic package component. |
摘要 |
There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component. |
申请公布号 |
PH30837(A) |
申请公布日期 |
1997.11.03 |
申请号 |
PH19560000497 |
申请日期 |
1995.01.09 |
申请人 |
OLIN CORPORATION |
发明人 |
BRATHWAITE, GEORGE, A.;RAMIREZ, GERMAN, J.;HOLMES, MICHAEL, A.;HOFMMAN, PAUL, R.;LIANG DEXIN |
分类号 |
H01L23/02;H01L23/10;H01L23/367 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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