| 摘要 |
PURPOSE:To prevent the occurrence of breakdown of a hot plate in resin molding and to prevent the occurrence of resin burr in a lead frame by providing a backing plate between the hot plate and supporting pins, and forming the hot plate on the backing plate with a material having excellent heat conductivity. CONSTITUTION:A hot plate 11 has the upper end surface in contact with the lower end surface of a chase block 5. The hot plate 11 houses heaters 4. The entire hot plate 11 is formed with a metal material, e.g., copper alloy and the like, whose heat conductivity is high. A backing plate 12 comprising a material having rigidity higher than that of the hot plate 11 is provided between the hot plate and supporting pins 3. Since the hot plate 11 having the high heat conductivity is used, the chase block 5 can be uniformly heated in resin molding. Thus the occurrence of resin burr in a lead frame can be prevented, and the occurrence of the breakdown of the hot plate 11 can be also prevented. |
