| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to manufacture a large non-contact type IC card without chipping by injection molding by mounting an IC module on one of labels and at the same time, packing a foamable resin into a space between both labels, in the IC card using a card base filled with resin between a pair of the labels. SOLUTION: Labels 3a, 3b are sheets on which a pictorial pattern or a character is printed for a card and at the same time, which serve as a support for fixing an IC module 1 in a mold. A printed layer 5 and a protecting layer 6 are sequentially formed on each of label bases 4. The IC module 1 consists of an antenna part and an IC part and is fixed to one of the labels 3a, 3b. In addition, the IC card comprises a card base of a resin packed in a space between both labels 3a, 3b arranged opposite to each other at an interval, and the resin is of a foamable type. Thus it is possible to efficiently manufacture the IC card without chipping in the IC chip part due to a resin pressure at the time of molding.</p> |
