| 发明名称 |
PHOTOMASK PELLICLE |
| 摘要 |
A method includes providing a carrier wafer, forming an indented portion on the carrier wafer, the indented portion having a sloped portion at an edge of the indented portion, bonding a pellicle wafer on the carrier wafer so as to form an open area within the indented portion, patterning the pellicle wafer to form a pellicle membrane over the indented portion and a pellicle membrane support structure over the sloped portion, and applying a mechanical force to disconnect the pellicle membrane from the pellicle wafer. |
| 申请公布号 |
US2016349609(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201514724397 |
申请日期 |
2015.05.28 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chung Chia-Chun;Hsu Chia-Hao;Shih Chih-Tsung |
| 分类号 |
G03F1/62;G03F1/76;G03F1/80;G03F1/50 |
主分类号 |
G03F1/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
providing a carrier wafer; forming an indented portion on the carrier wafer, the indented portion having a sloped portion at an edge of the indented portion; bonding a pellicle wafer on the carrier wafer so as to form an open area within the indented portion; patterning the pellicle wafer to form a pellicle membrane over the indented portion and a pellicle membrane support structure over the sloped portion; and applying a mechanical force to disconnect the pellicle membrane from the pellicle wafer. |
| 地址 |
Hsin-Chu TW |
