| 摘要 |
The present invention discloses an RF printed circuit module and the method of making it. The RF printed circuit module includes a first single-clad sheet having a dielectric layer and a metal layer attached to a top surface thereof, a second single-clad sheet having a dielectric layer and a metal layer attached to a bottom surface thereof, and a double-clad sheet having a dielectric layer with a first metal layer attached to a top surface and a second metal layer attached to a bottom surface, wherein the double-clad sheet is positioned between and attached to the first and second single-clad sheets. The first and second metal layers of the double-clad sheet are etched to form desired lumped and distributed circuit elements thereon. The metal layers of the first and second single-clad sheets are etched to provide ground planes and portions of external terminals for the RF printed circuit module. The RF printed circuit module is edge-plated along the perimeter thereof to connect the metal layers of the first and second single-clad sheets, with a portion of such edge-plating being removed on one side of the RF printed circuit module to form a pair of external terminals to permit electrical connection thereto by a surface mounting arrangement.
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