HIGH FREQUENCY AMPLIFIER, HIGH FREQUENCY COMMUNICATION EQUIPMENT, ACTIVE SEMICONDUCTOR DEVICE, IMPEDANCE MATCHING DEVICE AND LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide the high frequency amplifier at a low cost with high compatibility. SOLUTION: A mother board 219 composed of a printed board is mounted with an active semiconductor device 251 incorporating an active element 201 and an input impedance matching device 252 and an output impedance matching device 253 each incorporating a plurality of passive elements. The impedance matching is conducted by using the passive elements of the impedance matching devices 252, 253 depending on the distance between the active semiconductor device 251 and each of the impedance matching devices 252, 253. A printed pattern of a transmission line 220 is formed on the mother board 219. The devices 251, 252, 253 are contained in a resin sealing package and mounted on the mother board 219 through soldering. Thus, each of the devices 251, 252, 253 is individually mounted removably and the high frequency amplifier compatible with differences from frequencies or systems is realized at a low cost.