发明名称 HEAT CURABLE PHOTOSENSITIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To impart a superior chemical and heat resistances to a formed heat- cured pattern and to ensure a superior resolution in forming a pattern by incorporating a specified novolak resin as a base polymer acting also as a sensitizer and a specified melamine compd. as a heat curing agent. SOLUTION: This heat curable photosensitive material contains a resin having repeating units represented by formula I and a wt. average mol wt. of 1,000-30,000, a melamine compd. represented by formula II and a solvent dissolving them. The amt. of the melamine compd. is 5-30 pts.wt. per 100 pts.wt. of the resin. In the formula I, a residue of 1,2-naphthoquinonediazido-4-sulfonic ester and/or a residue of 1,2-naphthoquinonediazido-5-sulfornic ester has been substd. for 3-27mol% of the H atoms of phenolic hydroxyl groups on average and (m) is an integer of 0-3. In the formula II, each of X1 -X6 is H or -CH2 OY and Y is H or 1-6C straight chain or branched alkyl.
申请公布号 JPH1069078(A) 申请公布日期 1998.03.10
申请号 JP19960247146 申请日期 1996.08.29
申请人 SHIN ETSU CHEM CO LTD 发明人 KATO HIDETO;FUJII TOSHIHIKO;KANBARA HIROSHI;KOBAYASHI YOSHITAKA
分类号 G03F7/004;G02F1/1335;G03F7/023;G03F7/40;G11B5/31 主分类号 G03F7/004
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