摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the entry of plating liquid into a resistance element due to the dissolution of a re-vapor deposition film, by forming a re-vapor deposition preventive film before laser trimming and, after the laser trimming process, removing the re-vapor deposition preventive film together with the re-vapor deposition film by burning or cleaning. SOLUTION: Internal electrodes 20a, 20b are printed on both the ends of a resistor substrate 10 in the longitudinal direction, and then dried and fired. Thereafter, a resistance element 30 spreading across the internal electrodes 20a, 20b is formed by printing, drying and firing. Paste composed of paraffin or the like and soluble with water or hot water is printed in such a manner that is covers the portions of the resistance element to be trimmed, and is dried to form a re-vapor deposition preventive film 40. Subsequently, the specified regions of the resistance element 30 are trimmed by laser while a probe is applied to the internal electrodes 20a, 20b, respectively, to measure their resistance values. The re-vapor deposition preventive film 40 is cleaned and removed by water or hot water, and a re-vapor deposition film 50 is removed together. Then protective films 70, 80 are formed.</p> |