| 摘要 |
<p>PROBLEM TO BE SOLVED: To dispense with a removal operation through which Cu2 O is removed from an Mo mesh, so as to lessen a product in manufacturing cost by a method, wherein a resin layer which is decomposed at temperatures higher than a pre- oxidizing temperature but lower than a bonding temperature previously formed on a non-bonding surface before a pre-oxidation treatment is carried out. SOLUTION: A resin layer 10 is formed on a part of a Cu board 25 which is not bonded to a ceramic board or comes into contact with Mo meshes in a resin layer forming process. Usually, the Cu board 25 of OFC is subjected to a pre-oxidation treatment at a temperature of 250 to 300 deg.C, and the ceramic board and the Cu board 25 are DBC-bonded together at a temperature above 1000 deg.C. Therefore, it is preferable that resin does not decompose at a pre- oxidation treatment but is quickly decomposed and dissipated in a DBC bonding process, so that acrylic resin, polybutene resin or polyether resin that meets the above requirements is suitable as the resin material, taking its handling properties and stability into consideration, when the resin turns into liquid.</p> |
