| 摘要 |
PROBLEM TO BE SOLVED: To inject and harden a transparent resin at once by coating a spacer resin on a bump-forming surface, laminating and pressing a sheet, hardening the spacer resin, and peeling off a flexible sheet to protrude the heads of bump electrodes from the resin surface. SOLUTION: Solder bumps 11 are formed on emitter and collector electrodes of photo transistors on a wafer 10. A transparent resin 4 is flowed over the wafer 10 until covering the heads of the bumps 11. A sheet 14 with a deformable adhesive layer 13 is laminated and pressed on the heads of the bumps 11 and resin 4 until the adhesive layer 13 on the bumps 11 deforms the transparent resin in an uneven shape, and the resin 4 is hardened. The sheet 14 is peeled off to form spacers with the extruded heads of the bumps 11 by the thickness of the adhesive 13 on the surface covered with the resin. Thus the forming and hardening of the transparent resin can be made by one step. |
